Customization: | Available |
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Type: | Hand Held |
Payment Method: | Mobile Payment |
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Operation System | |
OS | Android 13.0 |
CPU model | Cortex Quad-core A53 with special secure CPU |
Memory | 1GB + 8 GB Flash (Optional 2+16GB) |
LCD Display | 5.99 inch high definition full display ,720*1440 IPS |
Touch Screen | Capacitive Five-Point Touch |
SIM card bands | 4G: FDD-LTE,TD-LTE 3G: WCDMA 2G: GSM,GPRS Hot spot |
Card reader | Magstripe Card ,Contact chip Card ,Contactless Card |
WIFI Module | 802.11a/b/g/n, 2.4G+5G |
Bluetooth | Support |
GPS | GPS/AGPS,GLONASS,BeiDou,Galileo |
USB | 2*USB C(one for Charge ,one for charging and communication) |
Rear Camera | 5 Mega-pixel |
Speaker | Support |
Microphone | Support |
Card Slot | 1*PSAM(MINI)+2*SIM(MICRO+MINI)+1*SD
2*PSAM(MINI)+1*SIM(MICRO)+1*SD (optional)
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Physical button | 1*Power button,1*VOL+/VOL-,1*function key |
Weight | 450g (one package box including product is 450g) |
Battery Capacity | 7.6V 2500mAh |
Power adapter | 5V DC/2A |
Printer | Paper width:58mm Max. paper roll diameter:40mm |
Standard Accessories | 1pc power adaptor, 1pc User Manual, 1pc USB-type C cable, 1 roll 58mm thermal paper |
Temperature | Storage temperature: -10ºC-60ºC Working Temperature: 0ºC-50ºC |
Optional function | |
Fingerprint collection module(optional) |
FAP20 LEVEL Spatial resolution :508 DPI(In compliance with FBI,STQC) |
Docking Station | Charging base (1*USB-C for charge)
Multifunctional base (2*USB-A for USB Host ,1*USB-C for charge, 1*RJ11,1*RJ45)
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Shenzhen Hosoton Technology Co., Ltd. is a experienced player in R&D, manufacturing and marketing digital smart industrial equipment, such as Tablet PC, pipe endoscope camera, handheld PDA scanner and any other ODM industrial devices. Our products are widely applied to logistics, store management, municipal construction, finance etc.
There is two services models for your option ,One is OEM service ,which is with customer's brand based on our off-the-shelf products ,the other is ODM service according to the individual demands ,which included Appearance design ,structure design ,Mold development ,software and hardware development etc.